Place of Origin : Shenzhen, China
Brand Name : WonDa
Packaging Details : Vacuum bag + Outer carton
Base Material : RF4,CEM-3,Halogen free,Aluminum material
Copper Thickness : 0.5-5 OZ
Board Thickness : 0.2-6.0mm
Min. Hole Size : 0.2mm
Min. Line Width : 4mil
Min. Line Spacing : 4mil
Surface Finishing : hal immersion gold immersion silver OSP
Number Of Layers : 8-Layer
Color : red ,green ,yellow, black, white
Certification : CE, ROHS, UL
MOQ : None
Price : Negotiable
Delivery Time : 5-15 days
Payment Terms : T/T, W.U, L/C
Supply Ability : 10000 Sq.meter/month
OurPCB Technical capabilities
NO |
ITEM |
Technical capabilities |
1 |
Layers |
2-20 layers |
2 |
Max. Board size |
2000×610mm |
3 |
Min. board Thickness |
2-layer 0.15mm |
4-layer 0.38mm |
||
6-layer 0.55mm |
||
8-layer 0.80mm |
||
10-layer 1.0mm |
||
4 |
Min. line Width/Space |
0.075mm(3mil) |
5 |
Max. Copper thickness |
6OZ |
6 |
Min. S/M Pitch |
0.075mm(3mil) |
7 |
Min. hole size |
0.1mm(4mil) |
8 |
Hole dia. Tolerance (PTH) |
±0.05mm(2mil) |
9 |
Hole dia. Tolerance (NPTH) |
+0/-0.05mm(2mil) |
10 |
Hole position deviation |
±0.05mm(2mil) |
11 |
Outline tolerance |
±0.10mm(4mil) |
12 |
Twist & Bent |
0.75% |
13 |
Insulation Resistance |
>1012 Ω Normal |
14 |
Electric strength |
>1.3kv/mm |
15 |
S/M abrasion |
>6H |
16 |
Thermal stress |
288°C 20Sec |
17 |
Test Voltage |
50-300V |
18 |
Min. blind/buried via |
0.15mm (6mil) |
19 |
Surface Finished |
HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold |
20 |
Materials |
FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base |
Hard drive pcb boards RF4 , CEM-3 base Images |